Liquid Cooling
Systems
Primary loops, secondary loops, CDUs, manifolds — engineered end-to-end for data centers operating at the frontier of AI compute.
Complete Liquid Cooling
Engineering, Start to Finish
DCE Systems designs, fabricates, and commissions the full liquid cooling loop for AI and HPC data centers. We do not supply components — we engineer systems. From the initial thermal model through to loop commissioning, every part of the process is managed by our team.
Our systems are built around 316L stainless steel for all wetted surfaces, passivated per ASTM A967 to SFN-grade cleanliness standards. All piping systems are designed to ASME B31.3 and pressure-tested before commissioning. Welding is performed to AWS D1.6 certified procedures.
The result: liquid cooling infrastructure that operates reliably in the most demanding data center environments — AI training clusters, HPC, high-density mixed deployments — from day one and for years thereafter.
End-to-End Loop Design
What We Engineer and Build
Primary Loop Systems
Large-bore stainless steel piping systems connecting the chiller plant to CDU arrays. Includes pumping skids with variable frequency drives (VFDs), pressure and flow instrumentation, isolation valves, and all associated headers and branches. Designed to ASME B31.3 Process Piping standard. Pressure-tested before commissioning.
- 316L stainless steel pipe to ASTM A312
- VFD pump skids — single or redundant
- Supply / return header systems
- ASME B31.3 design and testing
Secondary Loop & CDU
Coolant Distribution Units (CDUs) form the heart of the secondary cooling loop. DCE Systems supplies, configures, and integrates CDUs with the manifold systems, controls, and BMS interfaces required for production operation. CDUs provide heat exchange between the primary (facility) loop and the secondary (server rack) loop, with the secondary loop carrying a dielectric or corrosion-inhibited coolant directly to cold plates.
- Single or dual-circuit CDU configurations
- Plate-frame or shell-and-tube heat exchangers
- BMS / DCIM integration
- Flow, pressure, temperature monitoring
Manifold Systems
Supply and return manifolds distribute coolant from CDUs to individual rack connections. DCE Systems designs manifolds for ceiling (overhead), underfloor, and in-row configurations — each with specific trade-offs for maintenance access, structural load, and integration with containment. All manifolds are fabricated in 316L stainless steel, passivated to ASTM A967, and supplied with all fittings, valves, and connections pre-installed.
- Overhead / ceiling manifold runs
- Underfloor distribution manifolds
- In-row supply/return headers
- SFN-grade 316L stainless — ASTM A967 passivated
Cold Plates & Connectors
In-server cold plates mount directly on GPU and CPU packages, providing direct liquid cooling at the chip level. DCE Systems sources and integrates cold plate assemblies compatible with major AI accelerator platforms, and supplies the quick-disconnect (QD) connectors that allow servers to be inserted and removed from the rack without coolant draining or spillage. All connections are leak-tested before delivery.
- Cold plates for NVIDIA A100, H100, H200, AMD MI300X
- Push-fit and dry-disconnect QD connectors
- Leak testing and pressure testing included
- Integration with rack-level manifold system
Liquid Cooling Standards Compliance
Passivation
All stainless steel wetted components passivated per ASTM A967. Citric acid or nitric acid process per application, with post-treatment verification testing.
Process Piping
All liquid cooling piping systems designed, fabricated, and tested to ASME B31.3 Process Piping Code, including hydrostatic and pneumatic testing records.
Stainless Welding
All welding performed to AWS D1.6 Structural Welding Code — Stainless Steel. Welders qualified per WPQ, procedures qualified per PQR.
Quality Systems
Quality management processes align with ISO 9001 principles. Documentation packages include material certs, weld records, test records, and as-built drawings.
Ready to engineer your liquid cooling system?
Our engineers can review your requirements and propose a system architecture tailored to your data center's cooling demands.